Laser ablation is indeed a versatile and precise technique for material removal from solid surfaces using laser energy. Laser ablation is highly precise, allowing for micron-level control over material removal. This precision is particularly advantageous in industries where selective material removal is crucial. The Minimal Heat Affected Zone (HAZ) is also a significat feature: laser ablation is a relatively low-heat process that minimizes the heat-affected zone, reducing the risk of thermal damage to the surrounding material. Materials like metals, polymers, ceramics, and composites can be laser ablated. This versatility makes it suitable for a broad spectrum of applications across different industries. In addition to material removal, laser ablation is widely used for surface cleaning. It can efficiently remove contaminants, oxides, or unwanted layers from surfaces, ensuring a clean substrate for subsequent processes.

Stripping large surfaces is a complex and expensive process. It normally requires the use of chemicals, considerable water and many hours of work. An environmentally friendly and flexible alternative to traditional paint stripping is laser stripping. Laser paint removal involves using laser to remove a layer of paint from the metal substrate on which it is applied. The main advantage is that the beam acts selectively on the paint without touching the metal underneath. The process is ideal for removing paint in a specific area, for example when particular points on the surface, covered with paint in a previous passage, need to be stripped for subsequent functionalization. Of all the paint stripping processes available, laser stripping is the most environmentally friendly: The beam instantly vaporizes the paint without producing any waste or residue. If you are looking for a precise, selective process to perfectly strip irregular or easily damaged surfaces, laser is the solution for you.

Imagine the possibility of making thousands of holes of any caliber in a short time. And without producing any chips and at exactly defined locations. That's exactly what a CO₂ laser source can do. Laser drilling is one of the most diffused laser applications, along with its sibling laser microperforation. Basically, the laser beam striking the surface of a plastic, metal or ceramic material, makes the base material evaporate. The holes resulting from this operation will have neat edges and won't need further processing operations. Furthermore, for drilling applications you can use the same laser sources you would use for cutting operations! El.En.'s laser sources have been engineered to work on metals, ceramic and plastic materials in machine tool, packaging, food, printing and decoration industries.

Laser kiss cutting is a special cutting technique. It is very useful in the paper converting and label production industries: Laser kiss cutting aims at cutting only the top layer of a two-layered sheet instead of cutting through a sheet of paper, as in traditional laser cutting. The production of sticky labels is one of the main fields of application of this processing technique. The advantages of laser kiss cutting are remarkable: Since it is a non-contact process, there won't be any die or blade getting glued to the adhesive layer, avoiding the costs of tool cleaning. Futhermore, laser kiss cutting applications do not require special equipment: A single CO₂ laser source can achieve both laser kiss cut and laser cut through processing. Laser kiss cut is great to be employed in the paper and label industries, where it can be easily integrated into the printing process, but is also perfect for the coating and film industries.